NMCHIGHCAP Datasheet, PDF (10/11 Pages) NIC-Components Corp. – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
Taping Specifications
CARRIER TAPE MATERIAL
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type
A_o
B_o
01005 0.25 ± 0.04 0.45 ± 0.04
0201 0.37 ± 0.03 0.67 ± 0.05
0402 0.65 ± 0.05 1.15 ± 0.05
0603 1.1 ± 0.2 1.9 ± 0.2
0805 1.65 ± 0.2 2.4 ± 0.2
1206 2.0 ± 0.2 3.6 ± 0.2
W
8.0 ± 0.3
F
E
3.5 ± 0.05 1.75 ± 0.1
P1
2.0 ± 0.05
4.0 ± 0.10
P0
4.0 ± 0.1
D0
1.5
+0.1/-0.0
T1
max.
0.27
0.45
1.1
T2
max.
0.36
0.80
1.4
Mounting
Hole
Angular
Punch
Hole
PUNCHED CARRIER TAPE
D
t₁
Po
E
F
Bo
W
t₂
A_o
P1
Component
Pitch
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
Tape Size
8mm
12mm
W
F
E
8.0 ± 0.2 3.5 ± 0.05
1.75 ± 0.10
12.0 ± 0.2 5.5 ± 0.05
P₀
4.0 ± 0.1
P₂
2.0 ± 0.5
Notes:
1. Specifications are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
D
1.5
+0.1
-0.0
K max.
3.0
T max.
2.0
4.5
P
4.0 ± 0.1
8.0 ± 0.1
EMBOSSED PLASTIC CARRIER TAPE
D
T
P_o
P2
Bo
E
F
W
A_o
K
P
See notes 2 & 3 regarding dimensions
Ao and Bo
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
10
SPECIFICATIONS ARE SUBJECT TO CHANGE