NTL Datasheet, PDF (1/4 Pages) NIC-Components Corp. – Thin Film Chip Inductors

Thin Film Chip Inductors
NTL Series
FEATURES
• ULTRA-SMALL LOW PROFILE 0201, 0402 & 0603SIZES
• HIGH Q (15 ~ 40) @ 300MHz ~ 1.5GHz
• S-PARAMETER CHARACTERISTICS AVAILABLE
• HIGH CURRENT & HIGH SRF
• COMPATIBLE WITH Pb-FREE SOLDERING
• RoHS COMPLIANT
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
CHARACTERISTICS
Case Size
0201
0402
0603*
Inductance Range
1.0nH ~ 5.6nH
1.0nH ~ 15nH
1.0nH ~ 100nH
Available Tolerance
±0.1nH (B), ±0.2nH (C) & 2% (G)
±0.2nH (C) & 2% (G)
Temperature Range
-40°C ~ +125°C
Resistance to Solder Heat
270°C ±5°C for 10 seconds
Temperature Cycling
ΔL±10% after 10 cycles -40°C/+20°C/+85°C/+20°C
*Not recommended for new designs (see NTI06 series)
PART NUMBER SYSTEM
NTL 02 C 33N TR F
RoHS compliant
Tape & Reel Packaging
Inductance Value in nano-henries,
"N" indicates decimal point
Inductance Tolerance (see values tables)
Case Code
Series
CONSTRUCTION
Copper (Cu)
Termination Base
CASE DIMENSIONS (mm)
Case Sixe
L
W
T
P
0201 0.61 ± 0.05 0.31 ± 0.05 0.28 ± 0.05 0.12 ± 0.05
0402 1.0 ± 0.10 0.5 ± 0.10 0.40 ± 0.10 0.25 ± 0.10
0603 1.6 ± 0.10 0.8 ± 0.10 0.45 ± 0.10 0.30 ± 0.10
Etched Copper Coil
2µm Nickel (Ni) Barrier
3µm Tin (Sn) Outerplating
Alumina Substrate
T
LAND PATTERN DIMENSIONS (mm)
Case Sixe
A
B
C
D
0201
0.2 ~ 0.3 0.8 ~ 0.9 0.2 ~ 0.3 0.3 ~ 0.4
0402
0.5 ~ 0.6 1.5 ~ 1.8 0.5 ~ 0.6 0.5 ~ 0.6
0603
0.6 ~ 1.0 2.4 ~ 2.8 0.7 ~ 0.9 0.9 ~ 1.1
A
C
D
B
P
W
L
250°C
200°C
150°C
100°C
50°C
REFLOW SOLDERING PROFILE
10 sec. max.
250°C max.
220°C
130°C ~ 180°C
Time above 220°C -
60 ~ 90 sec. 30 ~ 90 sec. max.
Time (seconds)
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
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