NSWC Datasheet, PDF (1/3 Pages) NIC-Components Corp. – Stacked Film Capacitor Chips

Stacked Film Capacitor Chips
NSWC Series
FEATURES
• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM
• STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES
• WIDE TEMPERATURE RANGE UP TO +125^OC*
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS
nCHARACTERISTICS
• REFLOW SOLDERING ONLY
• TAPE AND REEL PACKAGING
NSWC IS
RECOMMENDED
FOR NEW DESIGNS
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
SPECIFICATIONS
Capacitance Range
Votage Ratings
Capacitance Tolerance
Temperature Range
Dissipation factor (20°C)
Insulation resistance (20°C)
Dielectric Withstanding
Voltage
1206
0.001 ~ 0.0047μF
Case Sizes
1210
1913
2416
2820
3022
3925
0.0056 ~ 0.01μF 0.012 ~ 0.082μF 0.1 ~ 0.15μF 0.18 ~ 0.33μF 0.39 ~ 0.47μF 0.56 ~ 1.0μF
100Vdc
0.001 ~ 0.01μF 5% (J) only,
0.012 ~ 0.15μF 5% (J) or 10% (K), 0.18 ~ 1.0μF 10% (K) only
-55°C ~ +105°C (0.001μF ~ 0.01μF)
-55°C ~ +125°C (0.012μF ~ 1.0μF with derating above +85°C)
1.0% max. @ 1KHz
3 Gigohms or 1000Ω/F whichever is lower
150% of Rated Voltage 60 Seconds
ENVIRONMENTAL CHARACTERISTICS
Life Test At +105°C
1,000 Hours at 125% of Rated Voltage
(125°C for 0.012μF ~ 1.0μF)
Resistance to Soldering Heat:
+240°C Peak
Humidity Load Life (90% ~ 95% RH)
(1) 1,000 Hours, +40°C
500 Hours for 0.012μF ~ 1.0μF
(2) 500 Hours, +60°C
for 0.001 ~ 0.01μF
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Within +1%/-6% of Initial Value
1.1% Maximum
1 Gigohm Minimum or 300Ω/F whichever is lower
Within ±5% for 0.012 ~ 1.0μF or ±3% for 0.001 ~ 0.01μF of initial value
1.1% Max. for 0.012 ~ 1.0μF or 0.66% Max. for 0.001 ~ 0.01μF
1 Gigohm Minimum or 300Ω/F whichever is lower
(1) +8%/-5%
(2) ±10% of Initial Value
(1) 1.5% Max.
(2) 2.0% Max.
(1) 100 Megohm Min. or 30Ω/F
(2) 10 Megohm Min. or 3Ω/F
whichever is lower
Solderability with
25% Wt Rosin-Methanol Flux
90% Minimum Coverage After 2.5 Second Dip Into 245°C Solder Pot
RECOMMENDED LAND
PATTERN (mm)
EIA Size A B C
1206 1.8 3.6 1.4
1210 1.8 3.6 2.3
1913 2.6 6.6 3.0
2416 3.8 7.8 3.8
2820 4.5 9.0 4.6
3022 5.1 9.7 5.0
3925 7.2 11.9 5.7
RECOMMENDED REFLOW PROFILE
300
250
200
150
100
50
25
Ramp-up
25°C ~ 150°C
0
90 sec. max.
Standard: +240 °C Peak Temperature
+250°C Special Order
(see part numbering system)
Time above 220°C
60 sec. max.
Cool Down
Pre-heat
150°C ~ 180°C
120 sec. max.
Time
A
B
®
PART NUMBER SYSTEM
NSWC 823 J 100 TR D4 N F
RoHS Compliant
Optional High Temp. Reflow (+250°C)*
Size Code
Tape & Reel
Voltage
Tolerance Code: J = ±5%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
*Special packaging and handling required.
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
1
SPECIFICATIONS ARE SUBJECT TO CHANGE