NEXCW Datasheet, PDF (1/2 Pages) NIC-Components Corp. – V-Chip Memory Back-Up Capacitors

V-Chip Memory Back-Up Capacitors
NEXCW Series
FEATURES
• DOUBLE LAYER CONSTRUCTION
• POWER BACK-UP FOR CMOS DEVICES
• SURFACE MOUNTABLE V-CHIP STYLE
• LEAD-FREE FINISH
RoHS Compliant
High Temperature Reflow
+260°C
CHARACTERISTICS
Rated Voltage Range
Rated Capacitance Range
Operating Temp. Range
3.5 & 5.5VDC
0.047F ~ 0.47F (47,000μF ~ 470,000μF)
-40°C ~ +85°C
Super Capacitor
Application Guide
Capacitance Tolerance
Load Life Test
+85°C 240 hours
Temperature Cycling
(5 cycles, -25 ~ +70°C
Humidity Resistance
(240 hours @ 40°C/90% RH)
+80%/-20% (Z)
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Within ±30% of initial measured value
Less than 200% of the specified maximum value
Less than 200% of the specified maximum value
Within +80%/-20% of specified value
Less than specified maximum value
Less than specified maximum value
Within ±20% of initial measured value
Less than 120% of the specified maximum value
Less than 120% of the specified maximum value
STANDARD VALUES AND SPECIFICATIONS
NIC P/N
Capacitance Working
Value (F) Voltage
Discharge (VDC)
NEXCW104Z3.5V10.7X5.5TRF
0.10
3.5
NEXCW224Z3.5V10.7X5.5TRF
0.22
3.5
NEXCW474Z3.5V10.7X8.5TRF
0.47
3.5
NEXCW473Z5.5V10.7X5.5TRF
0.047
5.5
NEXCW104Z5.5V10.7X5.5TRF
0.10
5.5
NEXCW224Z5.5V10.7X8.5TRF
0.22
5.5
Max. Current
@ 30 minutes
(mA)
0.090
0.200
0.420
0.071
0.150
0.330
Max. ESR
@ 1KHz
(Ω)
100
50
50
100
50
50
HIGH TEMPERATURE REFLOW PROFILE
Peak Temperature
250
(260°C)
200
Time above
150
217°C
70 sec. max.
100
Cool Down
Time above 170°C
50
50 sec. max.
25
Pre-heat
150°C ~ 200°C 150 sec. max.
0
Time
Peak Temperature
Time above +255°C
Time above +230°C
Time above +220°C
Time above +217°C
150°C ~ +200°C
(with time above +170°C
50 sec. max.)
+260°C
10 sec. max.
45 sec. max.
60 sec. max.
70 sec. max.
150 sec. max.
1. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals.
2. 2x reflow process maximum. Capacitor should be allowed to return to room temperature before second reflow process.
PRECAUTIONS
WASHING is NOT RECOMMENDED. Additional precautions can be found at
www.niccomp.com/precautions
If in doubt or uncertainty, please review your specific application - process details
with NIC’s technical support personnel: [e-mail]
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
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