NEXC Datasheet, PDF (1/3 Pages) NIC-Components Corp. – V-Chip Memory Back-Up Capacitors

V-Chip Memory Back-Up Capacitors
NEXC Series
FEATURES
• DOUBLE LAYER CONSTRUCTION
• POWER BACK-UP FOR CMOS DEVICES
• SURFACE MOUNTABLE V-CHIP STYLE
• LEAD-FREE FINISH
*For high temperature +85°C,
high temperature reflow parts
see the NEXCW series
CHARACTERISTICS
Rated Voltage Range
Rated Capacitance Range
Operating Temp. Range
3.5 & 5.5VDC
0.047F ~ 1.0F (47,000μF ~ 1,000,000μF)
-25°C ~ +70°C
Capacitance Tolerance
Load Life Test
+70°C 1,000 hours
Temperature Cycling
(5 cycles, -25 ~ +70°C
Humidity Resistance
(240 hours @ 40°C/90% RH)
+80%/-20% (Z)
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Δ Capacitance Change
Maximum ESR
Current at 30 minutes
Less than ±30% of initial measured value
Less than 200% of the specified maximum value
Less than 200% of the specified maximum value
Within +80%/-20% of specified value
Less than specified maximum value
Less than specified maximum value
Less than ±20% of initial measured value
Less than 120% of the specified maximum value
Less than 120% of the specified maximum value
STANDARD VALUES AND SPECIFICATIONS
NIC P/N
Capacitance Working Holding Max. Current Max. ESR
Value (F) Voltage Voltage @ 30 minutes @ 1KHz
Discharge (VDC) (VDC min.)
(mA)
(Ω)
NEXC104Z3.5V10.5X5.5TRF
0.1
3.5
-
0.090
50
NEXC224Z3.5V10.5X5.5TRF
0.22
3.5
-
0.200
25
NEXC474Z3.5V10.5X8.5TRF
0.47
3.5
-
0.420
25
NEXC473Z5.5V10.5X5.5TRF
0.047
5.5
4.2
0.071
50
NEXC104Z5.5V10.5X5.5TRF
0.1
5.5
4.2
0.150
25
NEXC224Z5.5V10.5X8.5TRF
0.22
5,5
4.2
0.330
25
NEXC474Z5.5V16X9.5TRF
0.47
5.5
4.2
0.710
13
NEXC105Z5.5V21X10.5TRF
1.0
5.5
4.2
1.500
7
CASE DIMENSIONS (mm)
Case Size Dφ ± 0.5 L max. A/B ±0.2
I
WP
10.5 x 5.5 10.5
5.5
10.8 3.6 ±0.5 1.2 5.0
10.5 x 8.5 10.5
8.5
10.8 3.6 ±0.5 1.2 5.0
16 x 9.5
16.0
9.5
16.3 6.8 ±1.0 1.2 5.0
21 x 10.5
21.0
10.5
21.6 7.0 ±1.0 1.4 10.0
Dφ
0.3mm max.
+_I
w
L
I ^I-
A
P
B
PRECAUTIONS
WASHING is NOT RECOMMENDED. Additional precautions can be found at
www.niccomp.com/precautions
If in doubt or uncertainty, please review your specific application - process details
with NIC’s technical support personnel: [e-mail]
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
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