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N-HFA60PA60C Datasheet, PDF (2/5 Pages) Nell Semiconductor Co., Ltd – FRED Ultrafast Soft Recovery Diode, 2 x 30 A
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SEMICONDUCTOR
N-HFA60PA60C RRooHHSS
Nell High Power Products
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Cathode to anode
breakdown voltage
VBR
Maximum forward voltage
VFM
Maximum reverse
leakage current
IRM
Junction capacitance
CT
(TJ = 25 ºC unless otherwise specified)
TEST CONDITIONS
MIN.
IR = 100 µA
600
IF = 30 A
-
IF = 60 A
-
IF = 30 A, TJ = 125 ºC
-
VR = VR rated
-
TJ = 125°C, VR = VR rated
-
VR = 150V
-
TYP.
-
1.4
1.7
1.1
-
-
36
MAX. UNITS
-
1.8
V
2.0
1.5
100
µA
500
-
pF
DYNAMIC RECOVERY CHARACTERISTICS PERLEG (TJ = 25 ºC unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP. MAX.
Reverse recovery time
IF = 0.5A, IR = 1.0A, IRR = 250mA (RG#1 CKT)
-
trr
IF = 1.0 A, dIF/dt = -100 A/µs, VR =30 V, TJ = 25°C
-
trr1
TJ = 25 ºC
-
30
35
23
-
30
50
Peak recovery current
Reverse recovery charge
trr2
IRRM1
IRRM2
Qrr1
Qrr2
TJ = 125 ºC
TJ = 25 ºC
TJ = 125 ºC
TJ = 25 ºC
TJ = 125 ºC
-
95
-
IF= 30A
-
dIF/dt = -200 A/µs
VR = 400 V
-
-
3
-
6
-
55
-
-
485
-
UNITS
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS PER LEG
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Junction to case,
single leg conduction
Junction to case,
both legs conducting
Tlead
0.063'' from case (1.6 mm) for 10 s
RthJC
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
RthJA
RthCS
Typical socket mount
Mounting surface, flat, smooth and greased
Weight
Mounting torque
Marking device
Case style TO-247AB (JEDEC)
MIN.
-
-
-
-
-
-
-
6.0
(5.0)
TYP.
-
-
MAX.
300
0.8
UNITS
°C
-
0.4
K/W
-
60
0.4
-
6.0
-
0.21
-
12
-
(10)
HFA60PA60C
g
oz.
kgf . cm
(lbf . in)
www.nellsemi.com
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