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N-HFA60PA40C Datasheet, PDF (2/5 Pages) Nell Semiconductor Co., Ltd – FRED Ultrafast Soft Recovery Diode, 2 x 30 A
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SEMICONDUCTOR
N-HFA60PA40C RRooHHSS
Nell High Power Products
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Cathode to anode
breakdown voltage
VBR
Maximum forward voltage
VFM
Maximum reverse
leakage current
IRM
Junction capacitance
CT
Series inductance
LS
(TJ = 25 ºC unless otherwise specified)
TEST CONDITIONS
MIN.
IR = 100 µA
400
IF = 30 A
-
IF = 60 A
-
IF = 30 A, TJ = 125 ºC
-
VR = VR rated
-
TJ = 125°C, VR = VR rated
-
VR = 200V
-
Measured lead to lead 5 mm from package body
-
TYP.
-
1.3
1.6
1.2
-
-
60
12
MAX. UNITS
-
1.5
V
-
-
100
µA
500
-
pF
-
nH
DYNAMIC RECOVERY CHARACTERISTICS PERLEG (TJ = 25 ºC unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP. MAX.
Reverse recovery time
IF = 0.5A, IR = 1.0A, IRR = 250mA (RG#1 CKT)
-
trr
IF = 1.0 A, dIF/dt = -100 A/µs, VR =30 V, TJ = 25°C
-
trr1
TJ = 25 ºC
-
28
35
22
-
32
50
Peak recovery current
Reverse recovery charge
trr2
IRRM1
IRRM2
Qrr1
Qrr2
TJ = 125 ºC
TJ = 25 ºC
TJ = 125 ºC
TJ = 25 ºC
TJ = 125 ºC
-
95
-
IF= 30A
-
dIF/dt = -200 A/µs
VR = 266 V
-
-
3
-
7
-
49
-
-
360
-
UNITS
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS PER LEG
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Junction to case,
single leg conduction
Junction to case,
both legs conducting
Tlead
0.063'' from case (1.6 mm) for 10 s
RthJC
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
RthJA
RthCS
Typical socket mount
Mounting surface, flat, smooth and greased
Weight
Mounting torque
Marking device
Case style TO-247AB (JEDEC)
MIN.
-
-
-
-
-
-
-
6.0
(5.0)
TYP.
-
-
MAX.
300
0.67
UNITS
°C
-
0.34
K/W
-
40
0.25
-
6.0
-
0.21
-
12
-
(10)
HFA60PA40C
g
oz.
kgf . cm
(lbf . in)
www.nellsemi.com
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