UPD75P108B Datasheet, PDF (6/46 Pages) NEC – 4-BIT SINGLE-CHIP MICROCOMPUTER

µPD75P108B
CONTENTS
1. PIN FUNCTIONS .................................................................................................................................... 7
1.1 PORT PINS ..................................................................................................................................................... 7
1.2 OTHER PINS ................................................................................................................................................... 8
1.3 PIN INPUT/OUTPUT CIRCUITS ................................................................................................................... 9
1.4 RECOMMENDED CONNECTION OF UNUSED PINS ................................................................................. 11
5
1.5 CAUTION ON USING P00/INT4 PIN AND RESET PIN .............................................................................. 12
2. DIFFERENCES BETWEEN µPD75P108B AND µPD75P116 ................................................................. 12
3. DIFFERENCES BETWEEN MASK VERSION (µPD75108) AND PROM VERSION (µPD75P108B) .. 13
4. PROM (PROGRAM MEMORY) WRITE AND VERIFY .......................................................................... 14
4.1 PROGRAM MEMORY WRITE/VERIFY OPERATING MODES ................................................................... 14
4.2 PROGRAM MEMORY WRITE PROCEDURE ................................................................................................ 15
4.3 PROGRAM MEMORY READ PROCEDURE ................................................................................................. 16
5
4.4 ERASUER METHOD (µPD75P108BDW only) .............................................................................................. 17
4.5 SCREENING OF ONE-TIME PROM PRODUCTS ......................................................................................... 17
5. ELECTRICAL SPECIFICATIONS ............................................................................................................ 18
6. CHARACTERISTIC CURVE (REFERENCE VALUE) .............................................................................. 30
7. RECOMMENDED SOLDERING CONDITIONS ..................................................................................... 36
8. PACKAGE INFORMATION .................................................................................................................... 37
APPENDIX A. DEVELOPMENT TOOLS ...................................................................................................... 39
5 APPENDIX B. RELATED DOCUMENTATIONS .......................................................................................... 40
APPENDIX C. FONCTIONAL DIFFERENCE AMONG µPD751×× SERIES ................................................ 42
6