UPD6132 Datasheet, PDF (56/64 Pages) NEC – 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION

µPD6132
15. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 15-1. Soldering Conditions for Surface-Mount Type
µPD6132MC-×××-5A4: 20-pin plastic SSOP (300 mil)
Soldering Method
Soldering Condition
Infrared reflow
VPS
Wave soldering
Partial heating
Package peak temperature: 235 °C; time: 30 secs. max. (210 °C min.);
count: three times max.
Package peak temperature: 215 °C; time: 40 secs. max. (200 °C min.);
count: three times max.
Solder bath temperature: 260 °C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120 °C max. (Package surface temperature)
Pin temperature: 300 ˚C or less ; time: 3 secs. max. (for each side of the device)
Recommended
Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
—
Caution Using more than one soldering method should be avoided (except in the case of partial heating).
56
Data Sheet U14332EJ1V0DS00