MC-7832-HA Datasheet, PDF (4/6 Pages) NEC – GaAs MULTI-CHIP MODULE

MC-7832-HA
NOTES ON CORRECT USE
(1) The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress
to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance.
Recommended that space is 2.0 to 3.0 mm typical.
(2) Recommended torque strength of the screw is 59 to 78 Ncm.
(3) Form the ground pattern as wide as possible to minimize ground impedance.
(to prevent undesired oscillation)
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Pin Part Heating
Soldering Conditions
Pin area temperature (pin temperature) : 350°C or below ^Note
Soldering time (per pin of device) : 3 seconds or less
Recommended Condition Symbol
−
Note The point of pin part heating must be kept more than 1.2 mm distance from the root of lead.
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Data Sheet PG10685EJ01V0DS