UPD4991A Datasheet, PDF (30/32 Pages) NEC – 4-BIT PARALLEL I/O CALENDAR CLOCK

µPD4991A
RECOMMENDED SOLDERING CONDITIONS
The following conditions must be met when soldering this product. Please consult with our sales offices when using
other soldering process or under different conditions.
Type of Surface Mounting Device
µPD4991 AGS
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating
method
Soldering conditions
Peak temperature of package surface: 235 °C or below,
Reflow time: 30 seconds or less (210 °C or higher),
Number of reflow process: 2, Exposure limit*: None
Peak temperature of package surface: 215 °C or below,
Reflow time: 40 seconds or less (200 °C or higher),
Number of reflow process: 2, Exposure limit*: None
Soldering temperature: 260 °C or below
Flow time: 10 seconds or less, Number of reflow process: 1,
Exposure limit*: None
Pin temperature: 300 °C or below,
Time: 10 seconds or below (per side of leads)
Symbols
IR35-00-2
VP15-00-2
WS60-00-1
—
* Exposure limit before soldering after dry-pack is opened.
Storage condition: 25 °C and relative humidity at 65 % or less.
Caution Do not apply more than a single process once, except for “Partial heating method.”
Type of Through-Hole Device
µPD4991 ACX
Soldering process
Wave soldering
Soldering conditions
Soldering temperature: 260 °C or below
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