UPD168116A Datasheet, PDF (24/26 Pages) NEC – 7-CHANNEL H-BRIDGE DRIVER WITH A MICRO STEP FUNCTION SUPPORTING PULSE INPUT

µ PD168116A
14. RECOMMENDED SOLDERING CONDITIONS
The µ PD168116A should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
µ PD168116AK9-9B4-A: 56-pin plastic WQFN (8 x 8)
Process
Conditions
Symbol
Infrared reflow
Package peak temperature: 260°C, Time: 60 seconds MAX. (at 220°C or higher) ,
Count: Three times or less, Exposure limit: 3 days ^Note (after that, prebake at 125°C for
10 hours) , Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Precaution>
Products other than in heat-resistant trays (such as those packaged in a magazine,
taping, or non-thermal-resistant tray) cannot be baked in their package.
IR60-103-3
Note After opening the dry pack, store it a 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating) .
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Data Sheet S16967EJ1V0DS