UPD9903 Datasheet, PDF (23/28 Pages) NEC – UPD9903 ANALOG SUBSCRIBER LINE LSI DIGITAL CODEC

µPD9903
6. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions, refer to the information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, please contact your NEC sales
representative.
SURFACE MOUNT TYPE
µPC9903GT: 48-pin plastic shrink SOP (375 mil)
Soldering Method
Soldering Conditions
Infrared ray reflow
Partial heating
method
Package peak temperature: 235 ˚C
Reflow time: 30 sec. max. (210 ˚C or above)
Number of times: 1 time
Pin temperature: 300 ˚C max.
Heat time: 3 sec. max. (per each side of the device)
Recommended
Condition Symbol
IR35-00-1
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23