UPD160040A Datasheet, PDF (18/19 Pages) NEC – 384-OUTPUT TFT-LCD SOURCE DRIVER

µPD160040A
9. RECOMMENDED MOUNTING CONDITIONS
The following conditions must be met for mounting conditions of the µPD160040A.
For more details, refer to the
5 [Semiconductor Device Mount Manual] (http://www.necel.com/pkg/en/mount/index.html)
Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under
different conditions.
µPD160040AN-xxx: TCP (TAB Package)
Mounting Condition
Mounting Method
Thermocompression Soldering
ACF
(Adhesive Conductive Film)
Condition
Heating tool 300 to 350°C, heating for 2 to 3 sec, pressure 100g (per
solder).
Temporary bonding 70 to 100°C, pressure 3 to 8 kg/cm², time 3 to 5
sec. Real bonding 165 to 180°C pressure 25 to 45 kg/cm², time 30 to
40 sec. (When using the anisotropy conductive film SUMIZAC1003 of
Sumitomo Bakelite, Ltd.)
Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF
manufacturing company. Be sure to avoid using two or more mounting methods at a time.
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Data Sheet S15918EJ1V0DS