UPD16337 Datasheet, PDF (12/16 Pages) NEC – 64-BIT AC-PDP DRIVER

µPD16337
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended below.
For soldering methods and conditions other than those recommended, please contact your NEC sales represen-
tative.
SURFACE MOUNT TYPE
For details of recommended soldering conditions, refer to the information document “Semiconductor Device
Mounting Technology Manual” (C10535E).
µPD16337GF-3BA
Soldering Method
Infrared reflow
VPS
Pin partial heating
Soldering Conditions
Package peak temperature: 230°C, Duration: 30 sec. MAX.
(at 210°C or above), Number of times: Twice, Time limit: None^Note
Package peak temperature: 215°C, Duration: 40 sec. MAX.
(at 200°C or above), Number of times: Twice, Time limit: None^Note
Pin partial temperature: 300°C MAX., Duration: 10 sec. MAX.,
Time limit: None^Note
Recommended
Condition Symbol
IR30-00-2
VP15-00-2
Note For the storage period after dry-pack decapsulation, storage conditions are max. 25°C, 65% RH.
Caution Use of more than one soldering method should be avoided (except in the case of pin partial
heating).
REFERENCES
NEC Semiconductor Device Reliability/Quality Control System (IEI-1212)
Quality Grade on NEC Semiconductor Devices (C11531E)
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