UPD16310 Datasheet, PDF (11/14 Pages) NEC – HIGH VOLTAGE CMOS DRIVER FOR PDP, EL, VFD

µPD16310
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product. Please consult with our sales
offices in case other soldering process is used, or in case soldering is done under different conditions.
µPD16310GF-3L9
Soldering process
Infrared ray reflow
VPS
Partial heating method
Soldering conditions
Peak package’s surface temperature: 230 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 1, Exposure limit*: None
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher),
Number of reflow process: 1, Exposure limit*: None
Terminal temperature: 300 °C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Symbol
IR30-00-1
VP15-00-1
* Exposure limit before soldering after dry-pack package is opened.
Storage coditions: 25 °C and relative humidity at 65 % or less.
Note Do not apply more than a single process at once, except for “Partial heating method.”
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