UPC8100GR Datasheet, PDF (1/16 Pages) NEC – SILICON UP/DOWN CONVERTERS IC FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC8100GR
SILICON UP/DOWN CONVERTERS IC
FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS
DESCRIPTION
µPC8100GR is a silicon monolithic integrated circuit designed as up/down converters for 800 MHz to 900 MHz mobile
communications, mainly CT2. This IC consists of upconverter and downconverter, which are packaged in 20 pin SSOP.
Quadrature modulator IC (µPC8101GR) is also available as for kit-use with this IC. So, these pair devices contribute to
make RF block small, high-performance and low power-consumption.
This product is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses silicon nitride
passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion
and migration. Thus, this product has excellent performance, uniformity and reliability.
FEATURES
• Operating frequency – fRF = 800 MHz to 900 MHz, fIF = 50 MHz to 150 MHz, fLo = 650 MHz to 1 050 MHz
• Upconverter and downconverter are integrated in 1 chip.
• 20 pin SSOP suitable for high-density surface mounting.
• Wide operating voltage VCC = 2.7 to 4.5 V
• Equipped with Power Save Function.
• Excellent linearity
APPLICATIONS
• Typical application – Digital cordless phone CT2.
• Further application – Digital cellular, etc.
ORDERING INFORMATION
PART NUMBER
µPC8100GR-E2
PACKAGE
20 pin plastic SSOP
(225 mil)
SUPPLYING FORM
Embossed tape 12 mm wide. QTY 2.5 kp/Reel.
Pin 1 indicates roll-in direction of tape.
Remark To order evaluation samples, please contact your local NEC sales office. (Order number: µPC8100GR)
Caution electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. P10817EJ3V0DS00 (3rd edition)
The mark shows major revised points.
Date Published October 1999 N CP(K)
Printed in Japan
©
1995,1999