UPC2749TB Datasheet, PDF (1/16 Pages) NEC – 3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC2749TB
3 V, SUPER MINIMOLD SILICON MMIC
WIDEBAND AMPLIFIER
FOR MOBILE COMMUNICATIONS
DESCRIPTION
The µPC2749TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This
IC is packaged in super minimold package which is smaller than conventional minimold.
The µPC2749TB has compatible pin connections and performance to µPC2749T of conventional minimold
version. So, in the case of reducing your system size, µPC2749TB is suitable to replace from µPC2749T.
This IC is manufactured using NEC’s 20 GHz fT NESAT^TM lll silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• High-density surface mounting
• Supply voltage
• Noise figure
• Upper limit operating frequency
: 6-pin super minimold package
: VCC = 2.7 to 3.3 V
: NF = 4.0 dB TYP. @ f = 1.9 GHz
: fu = 2.9 GHz TYP. @ 3 dB down below from gain at f = 0.9 GHz
APPLICATION
• GPS receiver
• Wireless LAN
ORDERING INFORMATION
Part Number
µPC2749TB-E3
Package
6-pin super minimold
Marking
C1U
Supplying Form
Embossed tape 8 mm wide.
1, 2, 3 pins face to perforation side of the tape.
Qty 3 kp/reel.
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
µPC2749TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P13489EJ2V0DS00 (2nd edition)
Date Published May 1999 N CP(K)
The mark shows major revised points.
Printed in Japan
©
1998, 1999