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UPC2747TB Datasheet, PDF (1/20 Pages) NEC – 3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUITS
µPC2747TB, µPC2748TB
3 V, SUPER MINIMOLD SILICON MMIC
AMPLIFIER FOR MOBILE COMMUMICATIONS
DESCRIPTION
The µPC2747TB, µPC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile
communications. These ICs are packaged in super minimold package which is smaller than conventional minimold.
The µPC2747TB, µPC2748TB have compatible pin connections and performance to µPC2747T, µPC2748T of
conventional minimold version. So, in the case of reducing your system size, µPC2747TB, µPC2748TB are suitable
to replace from µPC2747T, µPC2748T.
These ICs are manufactured using NEC’s 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability.
FEATURES
• High-density surface mounting
• Supply voltage
• Noise figure
• Upper limit operating frequency
: 6-pin super minimold package
: VCC = 2.7 to 3.3 V
: µPC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz
: µPC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz
: µPC2747TB ; fu = 1.8 GHz TYP.
: µPC2748TB ; fu = 1.5 GHz TYP.
APPLICATION
• Buffer amplifiers for mobile telephones, etc. (PDC800M, GSM)
ORDERING INFORMATION
Part Number
µPC2747TB-E3
µPC2748TB-E3
Package
6-pin super minimold
Marking
C1S
C1T
Supplying Form
Embossed tape 8 mm wide.
1, 2, 3 pins face to perforation side of the tape.
Qty 3 kp/reel.
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
µPC2747TB, µPC2748TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P13444EJ2V0DS00 (2nd edition)
Date Published June 1999 N CP(K)
The mark shows major revised points.
©
Printed in Japan
1998, 1999