NE681M23 Datasheet, PDF (1/2 Pages) NEC – NPN SILICON TRANSISTOR

PRELIMINARY DATA SHEET
NPN SILICON TRANSISTOR NE681M23
FEATURES
• NEW MINIATURE M23 PACKAGE:
– World's smallest transistor package footprint —
leads are completely underneath package body
– Low profile/0.55 mm package height
– Ceramic substrate for better RF performance
• HIGH GAIN BANDWIDTH PRODUCT:
fT = 7 GHz
• LOW NOISE FIGURE:
NF = 1.4 dB
DESCRIPTION
The NE681M23 transistor is ideal for low noise, high gain,
and low cost amplifier applications. NEC's new low profile/
ceramic substrate style "M23" package is ideal for today's
portable wireless applications. The NE681 is also available
in chip, Micro-x, and six different low cost plastic surface
mount package styles.
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE M23
0.5
1
0.25
0.4
2
3 0.25
0.6
0.15
0.2
0.15
BOTTOM VIEW
PIN CONNECTIONS
1. Collector
2. Emitter
3. Base
ELECTRICAL CHARACTERISTICS (TA = 25°C)
PART NUMBER
EIAJ¹ REGISTERED NUMBER
PACKAGE OUTLINE
SYMBOLS
fT
NF
|S21E|²
hFE2
ICBO
IEBO
CRE3
PARAMETERS AND CONDITIONS
Gain Bandwidth at VCE = 3 V, IC = 7 mA, f = 1 GHz
Noise Figure at VCE = 3 V, IC = 7 mA, f = 1 GHz
Insertion Power Gain at VCE = 3 V, IC = 7 mA, f = 1 GHz
Forward Current Gain at VCE = 3 V, IC = 7 mA
Collector Cutoff Current at VCB = 10 V, IE = 0
Emitter Cutoff Current at VEB = 1 V, IC = 0
Feedback Capacitance at VCB = 3 V, IE = 0, f = 1 MHz
UNITS
GHz
dB
dB
µA
µA
pF
Notes:
1. Electronic Industrial Association of Japan.
2. Pulsed measurement, pulse width ≤ 350 µs, duty cycle ≤ 2 %.
3. Capacitance is measured with emitter and case connected to the guard terminal at the bridge.
NE681M23
2SC5650
M23
MIN
TYP
MAX
4.5
7
1.4
2.7
10
12
80
145
0.8
0.8
0.9
California Eastern Laboratories