AQY221N2V Datasheet, PDF (5/6 Pages) Nais(Matsushita Electric Works) – RF (Radio Frequency) C x R 10 SSOP Type

AQY221N2V
CAUTIONS FOR USE
1. Short across terminals
Do not short circuit between terminals
when relay is energized. There is
possibility of breaking the internal IC.
2. Surge voltages at the input
If reverse surge voltages are present at
the input terminals, connect a diode in
reverse parallel across the input terminals
and keep the reverse voltages below the
reverse breakdown voltage.
1
4
2
3
5. Output spike voltages
1) If an inductive load generates spike
voltages which exceed the absolute
maximum rating, the spike voltage must
be limited.
Typical circuits are shown below.
1
4
Load
2
3
Add a clamp diode
to the load
1
4
3. Recommended LED forward current
(IF)
It is recommended that the LED forward
current (IF) be kept at 5mA.
4. Ripple in the input power supply
If ripple is present in the input power
supply, observe the following:
1) For LED operate current at Emin, main-
tain the value mentioned in the table of "3.
Recommended LED forward current (IF)."
2) Keep the LED operate current at 50
mA or less at Emax.
Load
2
3
Add a CR snubber
circuit to the load
2) If spike voltages generated at the load
are limited with a clamp diode and the
circuit wires are long, spike voltages will
occur by inductance.
Keep wires as short as possible to
minimize inductance.
6. Cleaning solvents compatibility
Dip cleaning with an organic solvent is
recommended for removal of solder flux,
dust, etc. Select a cleaning solvent from
the following table. If ultrasonic cleaning is
used, the severity of factors such as
frequency, output power and cleaning
solvent selected may cause loose wires
and other defects. Make sure these
conditions are correct before use. For
details, please consult us.
Cleaning solvent
Compatibility
(r: Yes !: No)
Chlorine • Trichlene
base
• Chloroethlene
r
• Indusco
Adueous • Hollis
r
• Lonco Terg
Alcohol • IPA
base
• Ethanol
r
Others
• Thinner
• Gasoline
!
Emin.
Emax.
7. Soldering
When soldering this terminals, the following conditions are recommended.
(1) IR (Infrared reflow) soldering method (2) Vapor phase soldering method
T3
T2
T2
T1
T1
(3) Double wave soldering method
T2
T1
t1
t2
T1 = 155 to 165°C 311 to 329°F
T2 = 180°C 200°C 356 to 392°F
T3 = 245°C 473°F or less
t1 = 120 s or less
t2 = 30 s or less
(4) Soldering iron method
Tip temperature: 280 to 300°C
536 to 572°F
Wattage: 30 to 60 W
Soldering time: within 5 s
t1
t2
T1 = 180 to 200°C 366 to 392°F
T2 = 215°C 419°F or less
t1 = 40 s
t2 = 40 s or less
t1
t2 t3
T1 = 155 to 165°C 311 to 329°F
T2 = 260°C 500°F or less
t1 = 60 s or less
t2+t3 = 5 s or less
(5) Others
Check mounting conditions before using
other soldering methods (hot-air, hot
plate, pulse heater, etc.)
• The temperature profile indicates the
temperature of the soldered terminal on
the surface of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
• The conditions for the infrared reflow
soldering apply when preheating using
the VPS method.
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