NFM31HK223R1H3 Datasheet, PDF (9/11 Pages) Murata Manufacturing Co., Ltd. – This product specification is applied to Chip EMIFIL

! ^Caution
10. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
・Pre-heating : 150°C, 1 minute ・Soldering iron output : 30W max.
・Tip temperature : 350°C max. ・Tip diameter : φ3mm max.
・Soldering time : 3(+1,-0) s
・Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic
material due to the thermal shock.
11. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
Upper Limit
Recommendable
t
1/3T  t T(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
12.Resin coating
The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin
to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use,
please make the reliability evaluation with the product mounted in your application set.
13. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw
to the substrate.
Excessive mechanical stress may cause cracking in the product.
　　　　　　Bending 　　　　　　　　　　　　　　　　
　　　　　Twisting
Failure to follow the above cautions may result, worst case, in a short circuit and cause fuming or partial dispersion
when the product is used.
14.Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused
by the abnormal function or the failure of our product.
15.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
　(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
　 (5)Medical equipment (6)Transportation equipment(trains, ships, etc.) (7)Traffic signal equipment
　 (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
　 (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
JEMCPC-02252A
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