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LPR2430ERA Datasheet, PDF (5/5 Pages) Murata Manufacturing Co., Ltd. – High Power 802.15.4 Module with Chip Antenna
L P R 2 4 3 0 E R A O u tlin e a n d M o u n tin g D im e n s io n s
1 .1 5
0 .0 4
0 .3 0
0 .0 5
15
0 .0 3
1
T o p V ie w
16
30
0 .1 1
0 .1 2
D im e n s io n s in in c h e s
Figure 2
Reflow Profile
An example solder reflow profile for mounting the radio module on its host circuit board is shown in Figure 3.
Note: Specifications subject to change without notice.
www.RFM.com E-mail: info@rfm.com
©2009 by RF Monolithics, Inc.
Figure 3
Part # M-2430-0005, Rev A
Page 5 of 5
LPR2430ERA - 06/19/09