LSM2-T Datasheet, PDF (3/12 Pages) Murata Manufacturing Co., Ltd. – DOSA-SMT, 30A POL DC/DC Converters

RECOMMENDED PAD LAYOUT
LSM2-T/30-D12 Series
DOSA-SMT, 30A POL DC/DC Converters
0.405 (10.29)
Optional Additional Ground
Pad Size: 0.095 x 0.082 (2.41 x 2.08)
0.120 (3.05)
0.089 (2.26)
0.000 (0.00)
0.025 (0.64)
Not Used SENSE TRIM
Vout
GND
SEQ
GND (-H)
ON/OFF
GND (-H)
Vin
Optional Additional Ground
Pad Size: 0.095 x 0.082 (2.41 x 2.08)
Pad Size: Min. 0.140 x 0.095 (3.56 x 2.08)
Dimensions are in inches (mm)
Additional Ground/Thermal Pads (“R” models)
The LSM2-T/30-D12 is optionally available with two additional ground
pads for increased current handling and better heat transfer. These are
indicated with the “R” designator in the model number, LSM2-T/30-D12R-C.
MPS recommends that users lay out their PC boards to accept these two
pads for larger current applications. Please note that the Derating curves for
the “R” models accept higher temperature and greater current limits than
units without the additional pads.
To realize the additional current and thermal capacity of “R” models, you
must have a substantial area of several square inches of copper etch flow-
soldered to these pads and sufficient feed-throughs or other means of con-
ducting current. The “R” pads and the standard pads 1 and 2 are in parallel.
If your application uses a standard DOSA pad layout and you cannot con-
nect to these ground pads, order model LSM2-T/30-D12-C without the “R”
designator. Please observe the lower Derating curves for standard, “non-R”
models.
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MDC_LSM2_T30_D12 Series.B11 Page 3 of 12