NCP18XH103F0SRB Datasheet, PDF (28/44 Pages) Murata Manufacturing Co., Ltd. – NTC Thermistors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Temperature Sensor Thermo String Type Specifications and Test Methods
R44E.pdf
Dec.17,2012
No.
Item
Specifications
1
High Temperature
Storage Test
2
Low Temperature
Storage Test
3
Humidity
Storage Test
· Resistance (R25°C) fluctuation rate: less than ±1%.
· B-Constant (B25/50°C) fluctuation rate: less than ±1%.
4
Temperature
Cycle
· Resistance (R25°C) fluctuation rate: less than ±2%.
· B-Constant (B25/50°C) fluctuation rate: less than ±1%.
5
High Temperature
Load
6
Insulation Break -
down Voltage
· No damage electrical characteristics at DC100 V, 1 min.
Test Methods
125±2°C in air, for 1000 +48/-0 hours without loading.
-40 +0/-3°C in air, for 1000 +48/-0 hours without loading.
60±2°C, 90 to 95%RH in air, for 1000 +48/-0 hours without
loading.
-40 +0/-3°C, 30 minutes in air
+25±2°C, 10 to 15 minutes in air
+125±2°C, 30 minutes in air
+ 25 +2/-0°C, 10 to 15 minutes in air (1 cycle)
Continuous 100 cycles, without loading.
85±2°C in air, with 'Operating Current for Sensor' for 1000
+48/-0 hrs.
2mm length of coating resin from the top of Thermistor is to be
dipped into beads of lead (Pb), and DC100V 1 minute is
applied to circuit between beads of lead (Pb) and lead wire.
Both lead wires are dipped into 350±10°C solder for 3.5±0.5
seconds, or 260±5°C solder for 10±1 seconds according to
Fig-1 (solder <JIS Z 3282 H60A>).
7
Resistance to
Soldering Heat
· Resistance (R25°C) fluctuation rate: less than ±1%.
· B-Constant (B25/50°C) fluctuation rate: less than ±1%.
5
1 to 2mm
8 Solderability
Solder
More than 90% of lead wire surface shall be covered by solder.
Fig-1
Both lead wires are dipped into flux (25wt% colophony <JIS K
5902> isopropyl alcohol <JIS K 8839>) for 5 to 10 seconds.
Then both lead wires are dipped into 235±5°C solder
<JIS Z 3282 H60A> for 2±0.5 seconds according to Fig-1.
The lead wire shall be inserted in a ø1.0mm hole until resin part
contacts with a substrate as shown in fig.-2, and 1N force for 10
seconds shall be applied to the lead wire.
9
Lead Wire
Pull Strength
· Resistance (R25°C) fluctuation rate: less than ±1%.
· B-Constant (B25/50°C) fluctuation rate: less than ±1%.
10
Lead Wire
Bending Strength
· Lead wire does not break.
1N (10 sec.)
Fig-2
Hold the lead wires as in Fig-3. Bend by 90 degrees and again
bend back to the initial position. Then bend to the other side by
90 degrees and again bend back to the initial position. After
bending process, 10N force for 3 seconds shall be applied to
the lead wire.
10N (3 sec.)
Fig-3
* · R25 is zero-power resistance at 25°C.
· B25/50 is calculated by zero-power resistance of Thermistor in 25°C -50°C.
· After each test, NTC Thermistor should be kept for 1 hour at room temperature (normal humidity and normal atmospheric pressure).
Continued on the following page.
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