GRM0222C1H4R2CA03 Datasheet, PDF (26/30 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitor

2. Land Dimensions
2-1. Chip capacitors can be cracked due to the stress
of PCB bending , etc. if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1
for flow soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
Chip Capacitor
Notice
Land
b
a
Solder Resist
Table 1 Flow Soldering Method
Series
Chip　Dimension
(L/W)　Code
GRM
18
Chip(L×W)
1.6×0.8
a
0.6 to 1.0
b
0.8 to 0.9
GRM
21
2.0×1.25
1.0 to 1.2
0.9 to 1.0
GRM
31
3.2×1.6
2.2 to 2.6
1.0 to 1.1
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
c
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
(in mm)
Table 2 Reflow Soldering Method
Series
Chip　Dimension
(L/W)　Code
GRM
01
GRM
02
GRM
03
GRM
15
GRM
18
GRM
21
GRM
31
GRM
32
GRM
43
GRM
55
Chip(L×W)
(Dimensions
Tolerance)
0.25×0.125
0.4×0.2
0.6×0.3
1.0×0.5
(within ±0.10)
1.0×0.5
（±0.15/±0.20）
1.6×0.8
(within ±0.10)
1.6×0.8
(±0.15/±0.20)
2.0×1.25
(within ±0.10)
2.0×1.25
(±0.15)
2.0×1.25
(±0.20)
3.2×1.6
(within±0.20)
3.2×1.6
(±0.30)
3.2×2.5
4.5×3.2
5.7×5.0
a
0.10 to 0.11
0.16 to 0.2
0.2 to 0.3
0.3 to 0.5
0.4 to 0.6
0.6 to 0.8
0.7 to 0.9
1.2
1.2
1.0 to 1.4
1.8 to 2.0
1.9 to 2.1
2.0 to 2.4
3.0 to 3.5
4.0 to 4.6
b
c
0.07 to 0.12
0.125 to 0.145
0.12 to 0.18
0.2 to 0.23
0.2 to 0.35
0.2 to 0.4
0.35 to 0.45
0.4 to 0.6
0.4 to 0.5
0.5 to 0.7
0.6 to 0.7
0.6 to 0.8
0.7 to 0.8
0.8 to 1.0
0.6
1.25
0.6 to 0.8
1.2 to 1.4
0.6 to 0.8
1.2 to 1.4
0.9 to 1.2
1.5 to 1.7
1.0 to 1.3
1.7 to 1.9
1.0 to 1.2
1.8 to 2.3
1.2 to 1.4
2.3 to 3.0
1.4 to 1.6
3.5 to 4.8
(in mm)
JEMCGC-2701X
26