NTSA0WF104EE1B0 Datasheet, PDF (22/47 Pages) Murata Manufacturing Co., Ltd. – NTC Thermistors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
R44E.pdf
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Feb.21,2011
Temp. Sensor and Compensation Chip Type !Caution/Notice
Continued from the preceding page.
3. Recommended Temperature Profile for Soldering
(a) Insufficient preheating may cause a crack on ceramic
body. The difference between preheating temperature
and maximum temperature in the profile shall be 100 °C.
(b) Rapid cooling by dipping in solvent or by other means is
not recommended.
NCP03/15 Series
Reflow Soldering Conditions
300
Preheating (in air)
Soldering
Gradual Cooling
(in air)
200
100
* In case of repeated soldering, the accumulated soldering
time should be within the range shown in the figure 2 above.
0
1-2 min. *20sec.
Preheating: 160±10°C, 1-2 min.
Soldering: 240-270°C, 20sec.
NCP18/21 Series
Flow Soldering Conditions
4
300
Preheating (in air)
Soldering
Gradual Cooling
(in air)
200
100
0
1-2 min. *10sec.
Preheating: 160±10°C, 1-2 min.
Soldering: 230-260°C, 10sec.
Reflow Soldering Conditions
Preheating (in air)
Soldering
Gradual Cooling
(in air)
300
200
100
0
1-2 min. *20sec.
Preheating: 160±10°C, 1-2 min.
Soldering: 230-270°C, 20sec.
4. Solder and Flux
(1) Solder and Paste
(a) Reflow Soldering: NCP03/15/18/21 Series
Use RA/RMA type or equivalent type of solder paste. For
your reference, we are using the solder paste below for
any internal tests of this product.
•RMA9086 90-4-M20 (Sn:Pb=63wt%:37wt%)
(Manufactured by Alpha Metals Japan Ltd.)
•M705-221BM5-42-11 (Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt%)
(Manufactured by Senju Metal Industry Co., Ltd.)
(b) Flow Soldering: NCP18/21 Series
We are using the solder paste below for any internal tests
of this product.
5. Cleaning Conditions
For removing the flux after soldering, observe the following
points in order to avoid deterioration of the characteristics or
any change of the external electrodes' quality.
• Please keep mounted parts and a substrate from an
occurrence of resonance in ultrasonic cleaning.
• Please do not clean the products in the case of using a
non-washed type flux.
6. Drying
After cleaning, promptly dry this product.
20
•Sn:Pb=63wt%:37wt%
•Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt%
(2) Flux
Use rosin type flux in soldering process.
If the flux listed below is used, some problems might be
caused in the product characteristics and reliability.
Please do not use the following flux.
• Strong acidic flux (with halide content exceeding
0.1wt%).
• Water-soluble flux
(*Water-soluble flux can be defined as non rosin type
flux including wash-type flux and non-wash-type flux.)
Solvent
NCP03/15
Isopropyl Alcohol
NCP18/21
Isopropyl Alcohol
Dipping Cleaning
Less than 5 minutes at
room temp. or less than
2 minutes at 40°C max.
Less than 5 minutes at
room temp. or less than
2 minutes at 40°C max.
Ultrasonic Cleaning
Less than 5 minutes and
20W/r
Frequency of 28kHz to
40kHz
Less than 1 minute and
20W/r
Frequency of several
10kHz to 100kHz
Continued on the following page.
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