GRJ43DR72E474KWJ1L Datasheet, PDF (215/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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10.12.20 ^{• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
Notice
Notice (Soldering and Mounting)
1. Construction of Board Pattern
After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremely careful in determining shape and dimension
before designing the circuit board diagram.
Construction and Dimensions of Pattern (Example)
Chip Capacitor
c
Solder Resist
L
W
b
a
Land
Dimensions of Slit (Example)
Chip Capacitor
Slit
Solder Resist
d
e
Land
L
W
Preparing the slit helps flux cleaning and resin
coating on the back of the capacitor.
However, the length of the slit design should
be as short as possible to prevent mechanical
damage in the capacitor.
A longer slit design might receive more severe
mechanical stress from the PCB.
Recommended slit design is shown in the
Table.
Flow Soldering
LgW
a
b
c
1.6g0.8
0.6-1.0
0.8-0.9
0.6-0.8
2.0g1.25
1.0-1.2
0.9-1.0
0.8-1.1
3.2g1.6
2.2-2.6
1.0-1.1
1.0-1.4
Flow soldering : 3.2g1.6 or less available.
Reflow Soldering
LgW
a
1.6g0.8
0.6-0.8
2.0g1.25
1.0-1.2
3.2g1.6
2.2-2.4
3.2g2.5
2.0-2.4
4.5g2.0
2.8-3.4
4.5g3.2
2.8-3.4
5.7g2.8
4.0-4.6
5.7g5.0
4.0-4.6
b
0.6-0.7
0.6-0.7
0.8-0.9
1.0-1.2
1.2-1.4
1.2-1.4
1.4-1.6
1.4-1.6
c
0.6-0.8
0.8-1.1
1.0-1.4
1.8-2.3
1.4-1.8
2.3-3.0
2.1-2.6
3.5-4.8
(in mm)
LgW
1.6g0.8
2.0g1.25
3.2g1.6
3.2g2.5
4.5g2.0
4.5g3.2
5.7g2.8
5.7g5.0
d
-
-
1.0-2.0
1.0-2.0
1.0-2.8
1.0-2.8
1.0-4.0
1.0-4.0
e
-
-
3.2-3.7
4.1-4.6
3.6-4.1
4.8-5.3
4.4-4.9
6.6-7.1
(in mm)
Continued on the following page.
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