GRM0222C1H4R4BA03 Datasheet, PDF (18/30 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitor

! ^Caution
4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
　　　　　[Standard Conditions for Flow Soldering]
Table 2
Temperature(℃)
Series
Chip　Dimension(L/W)　Code Temperature Differential
Soldering
Peak
GRM
18/21/31
ΔT≦150℃
Temperature
ΔT
Preheating
Peak
Temperature
Soldering
Gradual
Cooling
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as low as possible.
Preheating
Time
30-90 seconds 5 seconds max.
[Allowable Flow Soldering Temperature and Time]
280
270
3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
260
causing poor adhesion or a reduction in capacitance value
250
due to loss of contact between the inner electrodes and terminations.
240
4. When components are immersed in solvent after mounting,
be sure to maintain the temperature differential (ΔT)
between the component and solvent within the range
shown in the table 2.
Recommended Conditions
Lead Free Solder
230
220
0
10
20
30
40
Soldering Time(s)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Preheating Peak Temperature
100 to 120℃
Soldering Peak Temperature
250 to 260℃
Atmosphere
Lead Free Solder: Sn-3.0Ag-0.5Cu
Air or N2
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
Up to Chip Thickness
Adhesive
in section
JEMCGC-2701X
18