GRM3195C2A102JA01J Datasheet, PDF (174/182 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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Continued from the preceding page.
[Land for LLA Series]
[Land for LLM Series]
p
c
C02E.pdf
Sep.25,2013
Notice
Chip Capacitor
c
p
Land
Chip Capacitor
b'
f
d
Table 3 LLA Series Reflow Soldering Method
Part Number
Dimensions
Chip (LgW)
LLA Series 18 size
LLA Series 21 size
LLA Series 31 size
1.6g0.8
2.0g1.25
3.2g1.6
a
0.3 to 0.4
0.5 to 0.7
0.7 to 0.9
b
0.25 to 0.35
0.35 to 0.6
0.4 to 0.7
c
0.2 to 0.23
0.2 to 0.3
0.3 to 0.4
p
0.4
0.5
0.8
(in mm)
Table 4 LLM Series Reflow Soldering Method
Part Number
Dimensions
Chip
(LgW)
LLM Series 21 size
LLM Series 31 size
2.0g1.25
3.2×g1.6
a
b, b'
c, c'
0.6 to 0.8 (0.3 to 0.5)
0.3
1.0
(0.3 to 0.5)
0.4
b=(c-e)/2, b'=(d-f)/2
d
e
f
2.0 to 2.6 1.3 to 1.8 1.4 to 1.6
3.2 to 3.6 1.6 to 2.0
2.6
p
0.5
0.8
(in mm)
3. Board Design
When designing the board, keep in mind that the amount
of strain which occurs will increase depending on the size
and material of the board.
[Relationship with amount of strain to the board thickness,
length, width, etc.]
ε= ₂^_E^ȇ_w^/_h2 Relationship between load and strain
ε: Strain on center of board (μst)
/: Distance between supporting points (mm)
w: Board width (mm)
h: Board thickness (mm)
E: Elastic modulus of board (N/m²=Pa)
Y: Deflection (mm)
P: Load (N)
ȇ
Y
h
/
w
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (/) increases, the amount of
strain also increases.
Ë Reduce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.
Ë Increase the elastic modulus.
· As the board width (w) decreases, the amount of strain increases.
Ë Increase the width of the board.
· As the board thickness (h) decreases, the amount of strain increases.
Ë Increase the thickness of the board.
Since the board thickness is squared, the effect on the amount of strain
becomes even greater.
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