GJM1555C1H1R2CB01D Datasheet, PDF (170/182 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Sep.25,2013
Continued from the preceding page.
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand,
the board may bend. Firmly hold the edges of the board
with both hands when handling.
If a board mounted with capacitors is dropped, cracks
may occur in the capacitors.
Do not use dropped boards, as there is a possibility that
the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting
other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is
set too low, board deflection stress may be applied to
the capacitors on the back side (bottom side), and
cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead
point of the nozzle on the upper surface of the
board.
· Periodically check and adjust the bottom dead point.
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.)
into boards, bending the board may cause cracks in
the capacitors or cracks in the solder.
Pay attention to the following.
· Increase the size of the holes to insert the leads, to
reduce the stress on the board during insertion.
· Fix the board with backup pins or a dedicated jig
before insertion.
· Support below the board so that the board does not
bend. When using multiple backup pins on the
board, periodically confirm that there is no
difference in the height of each backup pin.
2-3. Attaching/Removing Sockets
When the board itself is a connector, the board may
bend when a socket is attached or removed. Plan the
work so that the board does not bend when a socket
is attached or removed.
!Caution
Suction Nozzle
Component with Leads
Socket
2-4. Tightening Screws
The board may be bent, when tightening screws, etc.
during the attachment of the board to a shield or
chassis.
Pay attention to the following items before performing
the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening
of the screws.
· The board may bend after mounting by reflow
soldering, etc. Please note, as stress may be
applied to the chips by forcibly flattening the board
when tightening the screws.
Screwdriver
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