GRM0222C1H4R3WA03 Datasheet, PDF (17/30 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitor

! Caution
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
[Standard Conditions for Reflow Soldering]
Temperature(℃)
Peak Temperature
220℃
ΔT
190℃
170℃
150℃
Soldering
Gradual
Cooling
Preheating
Time
60-120 seconds 30-60 seconds
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
[Allowable Reflow Soldering Temperature and Time]
280
Table 1
Series Chip　Dimension(L/W)　Code Temperature Differential
270
260
GRM
01/02/03/15/18/21/31
ΔT≦190℃
250
240
GRM
32/43/55
ΔT≦130℃
230
220
0
30
60
90
120
Soldering Time(s)
Recommended Conditions
Peak Temperature
Lead Free Solder
240 to 260℃
Atmosphere
Lead Free Solder: Sn-3.0Ag-0.5Cu
Air or N₂
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose
from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks to the PCB.
JEMCGC-2701X
17