GRM21BR71E155KA88L Datasheet, PDF (168/182 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Sep.25,2013
!Caution
Continued from the preceding page.
2. Check the cropping method for the printed circuit board
in advance.
2-1. Printed circuit board cropping shall be carried out by
using a jig or an apparatus (Disk separator, router
type separator, etc.) to prevent the mechanical stress
that can occur to the board.
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
(2) Disk Separator
(3) Router Type Separator
Level of stress on board
High
Medium
Medium
Low
Recommended
Notes
Ê·
Hand and nipper
separation apply a high
level of stress.
Use another method.
˚*
· Board handling
· Board bending direction
· Layout of capacitors
˚*
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
̋
Board handling
* When a board separation jig or disk separator is used, if the following precautions are not observed, a large board deflection stress will occur and the capacitors
may crack. Use router type separator if at all possible.
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as
follows. Recommended example: Stress on the
component mounting position can be minimized by
holding the portion close to the jig, and bend in the
direction towards the side where the capacitors are
mounted. Not recommended example: The risk of
cracks occurring in the capacitors increases due to
large stress being applied to the component
mounting position, if the portion away from the jig
is held and bent in the direction opposite the side
where the capacitors are mounted.
[Outline of Jig]
Printed Circuit Board
V-groove
Board Cropping Jig
Printed Circuit Board
Recommended
Direction of Load
Components
Load Point
Not recommended
Load Point
Direction of Load
Printed Circuit Board
Components
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the
board, the risk of cracks occurring can not be
avoided with the above method.
Therefore, implement the following measures to
prevent stress from being applied to the components.
(Measures)
(1) Consider introducing a router type separator.
If it is difficult to introduce a router type separator,
implement the following measures. (Refer to item
1. Mounting Position)
(2) Mount the components at a right angle to the
board separation surface.
(3) When mounting components near the board
separation point, add slits in the separation
position near the component.
(4) Keep the mounting position of the components
away from the board separation point.
Continued on the following page.
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