GJM1555C1H5R6CB01D Datasheet, PDF (167/182 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Sep.25,2013
!Caution
Continued from the preceding page.
3-2. A soldering iron with a tip of ø3mm or smaller should
be used. It is also necessary to keep the soldering
iron from touching the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for
soldering.
<Applicable to KR3/KRM Series>
4. For the shape of the soldering iron tip, refer to the figure
on the right.
Regarding the type of solder, use a wire diameter of
ø0.5mm or less (rosin core wire solder).
How to Apply the Soldering Iron
Apply the tip of the soldering iron against the lower end of
the metal terminal.
1) In order to prevent cracking caused by sudden heating of
the ceramic device, do not touch the ceramic base directly.
2) In order to prevent deviations and dislocating of the chip,
do not touch the junction of the chip and the metal
terminal, and the metal portion on the outside directly.
17
26
R0.5
Tip of Soldering Iron
Tip temperature: 350°C or less/
5 sec. or less/60W or less
(in mm)
Copper Land
Wire Solder
Apply the tip of the soldering iron only
on the terminal portion, without touching
the body of the chip.
Appropriate Amount of Solder
The amount of solder for corrections by soldering iron,
should be lower than the height of the lower side of the chip.
Cross Section
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
6. Electrical Test on Printed Circuit Board
1. Confirm position of the backup pin or specific jig, when
inspecting the electrical performance of a capacitor after
mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the
pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB,
resulting in cracked chips or open solder joints.
Provide backup pins on the back side of the PCB to
prevent warping or flexing. Install backup pins as
close to the capacitor as possible.
1-2. Avoid vibration of the board by shock when a
test-probe contacts a printed circuit board.
[Not Recommended]
Peeling
[Recommended]
Test-probe
Backup Pin
Test-probe
7. Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do
not apply any stress to the capacitor that causes bending
or twisting the board.
1-1. In cropping the board, the stress as shown at right
may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the
insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
148
[Bending]
[Twisting]
Continued on the following page.