LLA319R70G225MA01L Datasheet, PDF (12/23 Pages) Murata Manufacturing Co., Ltd. – CHIP MONOLITHIC CERAMIC CAPACITOR LLA319R70G225MA01_ (1206, X7R, 2.2uF, 4Vdc)

■ Soldering and Mounting
! Caution
!
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing
or bending of the board.
　[Component Direction]
　[Chip Mounting Close to Board Separation Point]
Locate chip
horizontal to the
direction in
which stress
acts
C
Perforation
B
D
A
Slit
Chip arrangement
Worst A-C-(B~D) Best
　
2.Information before mounting
1. Do Not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the Solderability for the capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
JEMCAC-00640B
12