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MSK5231 Datasheet, PDF (2/5 Pages) M.S. Kennedy Corporation – Hermetic Surface Mount Package
ABSOLUTE MAXIMUM RATINGS
VIN Input to Output Voltage Differential ○ ○ ○ ○ 35V
I Output Current 4A OUT
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PD Power Dissipation ○ ○ ○ ○ ○ ○ ○ Internally Limited
ELECTRICAL SPECIFICATIONS
TST Storage Temperature Range ○ ○ ○ -65°C to +150°C
T Lead Temperature 300°C LD
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(10 Seconds Soldering)
TJ Operating Temperature
MSK 5231 -40°C to+85°C ○
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MSK 5231H ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○- 5 5 ° t o + 1 2 5 ° C
Parameter
Test Conditions 1 4
Group A
Subgroup
MSK 5231H
MSK 5231
Min. Typ. Max. Min. Typ. Max. Units
(VIN-VOUT)=3V IOUT=10mA
1
1.238 1.250 1.262 1.230 1.250 1.270 V
Reference Voltage
1
1.220 1.250 1.270 1.215 1.250 1.275 V
1.5V ≤ (VIN-VOUT) ≤ 25V 10mA ≤ IOUT ≤ 2.0A
2,3
1.220 1.250 1.270
-
-
-
V
Dropout Voltage 2
IOUT=2.0A ΔVREF=1%
1
-
1.3 1.5
-
1.3 1.5
V
2,3
-
1.3 1.5
-
-
-
V
Line Regulation
1.5V ≤ (VIN-VOUT) ≤ 15V IOUT=10mA
1
15V ≤ (VIN-VOUT) ≤ 35V IOUT=10mA
2,3
-
0.02 0.2
-
0.05 0.5
-
0.02 0.4
%
-
-
-
%
Load Regulation
1
-
0.1 0.8
-
0.1 1.0
%
VIN-VOUT=3V 10mA ≤ IOUT ≤ 2.0A
2,3
-
0.2 1.0
-
-
-
%
Current Limit 2
VIN-VOUT=5.0V
VIN-VOUT=25V
1
3.2
4.0
2
3.2
4.0
-
A
2,3
3.2
4.0
-
-
-
-
A
1
0.2
0.5
-
0.2
0.5
-
A
2,3
0.2
0.5
-
-
-
-
A
F=120Hz CADJ=25μF
Ripple Rejection 2
COUT=25μF IOUT=2.0A
4
60
75
-
60
75
-
dB
VIN-VOUT=3.0V
1
Adjust Pin Current 1.5V ≤ (VIN-VOUT) ≤ 25V 10mA ≤ IOUT ≤ 2.0A
2,3
-
55 120
-
55
120
μA
-
55 120
-
-
-
μA
Minimum Load Current 2
(VIN-VOUT)=24V
1
-
5
10
-
5
10
mA
2,3
-
5
10
-
-
-
mA
Thermal Regulation 2
30mS pulse TA=25°C
1
-
0.004 0.02
-
0.004 0.02 %/W
Temperature Stability 2
-55°C ≤ TJ ≤ +125°C
-
-
0.5
-
-
0.5
-
%
Thermal Resistance 2
Junction to Case @ 125°C
-
-
0.8 1.5
-
0.8 1.7 °C/W
NOTES:
1 Output decoupled to ground using 20μF minimum capacitor unless otherwise specified.
2 This parameter is guaranteed by design but need not be tested.
3 Typical parameters are representative of actual device performance but are for reference only.
4 All output parameters are tested using a low duty cycle pulse to maintain TJ = TC.
5 Industrial grade devices shall be tested to subgroup 1 unless otherwise specified.
6 Military grade devices ('H' suffix) shall be 100% tested to subgroups 1,2,3.
7 Subgroup 1,4 TA=TC=+25°C
2,5 TA=TC=+125°C
3,6 TA=TC=-55°C
2
8548-21 Rev. A 2/12