MSK3016_15 Datasheet, PDF (2/5 Pages) M.S. Kennedy Corporation – Isolated Package for Direct Heat Sinking, Excellent Thermal Conductivity

ABSOLUTE MAXIMUM RATINGS
VDSS
VDGDR
VGS
ID
IDM
RTH-JC
RTH-JC
Drain to Source Voltage ○ ○ ○ ○ 200V MAX
Drain to Gate Voltage
(R =1MΩ) 200V MAX GS
○
○
○
○
○
○
○
○
○
○
○
Gate to Source Voltage
(Continuous)
±20V MAX ○
○
○
○
○
○
○
○
○
○
Continuous Current ○ ○ ○ ○ ○ ○ ○ 20A MAX
Pulsed Current ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 30A MAX
Thermal Resistance
(Junction to Case)@25°C ○ ○ ○ ○ ○ 1.3°C/W
Thermal Resistance
(Junction to Case)@125°C ○ ○ ○ ○ 2.1°C/W
Single Pulse Avalanche Energy ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 410 mJ
TJ
Junction Temperature
○
○
○
○
○
○
○
○
○
○
+150°C MAX
○
TST Storage Temperature ○ ○ ○ ○ ○ ○ ○ ○ ○ -55°C to +150°C
TC Case Operating Temperature Range -55°C to +125°C
TLD Lead Temperature Range
(10 Seconds Lead Only) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 200°C MAX
ELECTRICAL SPECIFICATIONS
Parameter
Test Conditions 4
Min.
MSK30016
Typ.
Max.
Units
Drain-Source Breakdown Voltage
VGS=0 ID=0.25mA
200
-
-
V
Drain-Source Leakage Current
VDS=200V VGS=0V
-
-
250
μA
Gate-Source Leakage Current
VGS=±20V VDS=0
-
-
±100
nA
Gate-Source Threshold Voltage
VDS=VGS ID=250μA
2.0
-
4.0
V
Drain-Source On Resistance 2
VGS=10V ID = 20A
-
-
0.12
Ω
Drain-Source On Resistance 3
VGS=10V ID=20A
-
-
0.09
Ω
Forward Transconductance 1
VDS=50V ID=20A
2.7
-
-
S
Total Gate Charge 1
ID = 20A
-
-
140
nC
Gate-Source Charge 1
VDS=160V
-
-
28
nC
Gate-Drain Charge 1
Turn-On Delay Time ¹
VGS = 10V
VDD=100V
-
-
74
nC
-
16
-
nS
Rise Time 1
ID = 20A
-
86
-
nS
Turn-Off Delay Time 1
RG = 6.2Ω
-
70
-
nS
Fall Time 1
RD = 3.2Ω
-
62
-
nS
Input Capacitance 1
Output Capacitance ¹
VGS=0V
VDS=25V
-
2800
-
pF
-
780
-
pF
Reverse Transfer Capacitance 1
f=1MHz
-
250
-
pF
Body Diode
Forward On Voltage 1
IS=20 A VGS=0V
-
2.0
-
V
Reverse Recovery Time 1
IS=20 A di/dt=100A/μS
-
360
540
nS
Reverse Recovery Charge 1
-
4.6
6.9
μC
NOTES:
1 This parameter is guaranteed by design but need not be tested. Typical parameters are representative of actual device performance but are for reference only.
2 Resistance as seen at package pins.
3 Resistance for die only; use for thermal calculations.
4 TA=25°C unless otherwise specified.
2
Rev. A 7/10