DL200 Datasheet, PDF (89/670 Pages) Motorola, Inc – Sensor

Freescale Semiconductor, Inc.
Positive Acceleration Sensing Direction
1
16
2
15
3
14
–X
4
13
+X
5
12
6
11
7
10
8
9
16–Pin SOIC Package
N/C pins are recommended to be left FLOATING
Top View
MMA2202D
87 6 5 4 3 2 1
9 10 11 12 13 14 15 16
Front View
Direction of Earth’s gravity field.*
Side View
* When positioned as shown, the Earth’s gravity will result in a positive 1g output
ORDERING INFORMATION
Device
MMA2202D
Temperature Range
*40 to +85°C
Case No.
Case 475–01
Package
SOIC–16
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
footprint, the packages will self–align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and short-
ing between solder pads.
Motorola Sensor Device Data _{For Mor}w_eww_In.m_foot_ro_mro_ala_t.c_ioom_n/s_Oem_nic_To_hnd_isuc_Pto_rr_os _duct,
Go to: www.freescale.com
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