MMA2301D Datasheet, PDF (7/7 Pages) Motorola, Inc – Surface Mount Micromachined Accelerometer

Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
A
G/2
16
A
G
9
2 PLACES, 16 TIPS
0.15 T A B
B
P
1
8
B
16X D
0.13 M T A B
C
0.1
K
T
SEATING
PLANE
R X 45˚
J
M
F
CASE 475-01
ISSUE B
16 LEAD SOIC
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS "A" AND "B" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
PER SIDE.
4. DIMENSION "D" DOES NOT INCLUDE DAMBAR
PROTRUSION. PROTRUSIONS SHALL NOT
CAUSE THE LEAD WIDTH TO EXCEED 0.75.
MILLIMETERS
DIM MIN MAX
A 10.15 10.45
B 7.40 7.60
C 3.30 3.55
D 0.35 0.49
F 0.76 1.14
G 1.27 BSC
J 0.25 0.32
K 0.10 0.25
M 0˚
7˚
P 10.16 10.67
R 0.25 0.75
DATE 05/17/01
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct footprint,
the packages will self-align when subjected to a solder reflow
process. It is always recommended to design boards with a
solder mask layer to avoid bridging and shorting between solder
pads.
0.380 in.
9.65 mm
0.050 in.
1.27 mm
0.024 in.
0.610 mm
0.080 in.
2.03 mm
Figure 5. Footprint SOIC-16 (Case 475-01)
Motorola Sensor Device Data
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MMA2301D
7