MOC2R6010 Datasheet, PDF (6/8 Pages) Motorola, Inc – OPTOISOLATOR 2 AMPS RANDOM-PHASE TRIAC OUTPUT 600 VOLTS

MOC2R60-10 MOC2R60-15
Use care to maintain the minimum spacings as
shown. Safety and regulatory requirements dictate
a minimum of 8.0 mm between the closest points
between input and output conducting paths,
Pins 3 and 7. Also, 0.070 inches distance is
required between the two output Pins, 7 and 9.
Keep pad sizes on Pins 7 and 9 as large as possible for
optimal performance.
0.315” min
[8 mm min]
Figure 16. PC Board Layout Recommendations
0.070” MIN
Each device, when installed in the circuit
shown in Figure 17, shall be capable of
passing the following conducted noise tests:
• IEEE 472 (2.5 KV)
• Lamp Dimmer (NEMA Part DC33, w 3.4.2.1)
• NEMA ICS 2-230.45 Showering Arc
• MIL-STD-461A CS01, CS02 and CS06
Device Under Test
23
79
I _F = Rated IF
10 Ω
0.022 µF
Noise
Source
MOV
150 V
Z Load
AC
Supply
Figure 17. Test Circuit for Conducted Noise Tests
Junction
Temperature of
MOC2R60 . . .
Output Chip
No Additional Heatsink
TJ
TC
{ RθJC
Heat Flow
R_θCA
With Additional Heatsink
TJ
TC
TS
R_θJC
R_θCS
R_θSA
TA
} Ambient Air
Temperature
TA
Terms in the model signify:
TA = Ambient temperature
TS = Optional additional
heat sink temperature
TC = Case temperature
TJ = Junction temperature
PD = Power dissipation
R_θSA = Thermal resistance, heat sink to ambient
R_θCA = Thermal resistance, case to ambient
R_θCS = Thermal resistance, heat sink to case
R_θJC = Thermal resistance, junction to case
Values for thermal resistance components are: R_θCA = 36°C/W/in maximum
R_θJC = 8.0°C/W maximum
The design of any additional heatsink will determine the values of R_θSA and R_θCS.
TC – TA = PD (R_θCA)
= PD (R_θJC) + R_θSA), where PD = Power Dissipation in Watts.
Figure 18. Approximate Thermal Circuit Model
X
Thermal measurements
of R_θJC are referenced to
the point on the heat tab
indicated with an ‘X’.
Measurements should be
taken with device orientated
along its vertical axis.
6
Motorola Optoelectronics Device Data