MC33793 Datasheet, PDF (22/24 Pages) Motorola, Inc – Distributed System Interface (DSI) Sensor Interface

Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
PIN'S
NUMBER
1
PIN 1 INDEX
8
0.50
0.25
X45°
D SUFFIX
16-LEAD SOIC NARROW BODY
PLASTIC PACKAGE
CASE 751B-05
ISSUE K
0.25 M B
6.2
A
8X _5.8
16
1.75
1.35
4
10.0
9.8
A
A
9
4.0
3.8
B
5
0.25
0.10
16X
0.49
0.35
6
0.25 ^M T A B
14X
1.27
T
SEATING
PLANE
16X
0.1 T
0.25
0.19
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. DATUMS A AND B TO BE DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURRS. MOLD FLASH,
PROTRUSION OR GATE BURRS SHALL NOT EXCEED
0.15 MM PER SIDE. THIS DIMENSION IS DETERMINED
AT THE PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE INTER-LEAD
FLASH OR PROTRUSIONS. INTER-LEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER
SIDE. THIS DIMENSION IS DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED
0.62 MM.
1.25
0.40
7^°
0°
SECTION A-A
33793
22
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