MC13146 Datasheet, PDF (15/16 Pages) Motorola, Inc – Low Power Integrated Transmitter for ISM Band Applications

Freescale S_Me_Cm₁i₃c₁₄o₆nductor, Inc.
OUTLINE DIMENSIONS
ARCHIVED BY FREESCALE SEMICONDUCTO^FTR^A,^SI^UN^FC^FIX. 2005
PLASTIC PACKAGE
CASE 977–02
4X
(LQFP–24)
0.200 AB T–U Z
ISSUE A
A
9
A1
24
19
1
V
Y
T
6
V1
Y
Y
18
B
U B1
13
7
12
Z
S1
S
4X
0.200 AB T–U Z
AD
AB
AC
0.080 AC
NOTES:
1 CONTROLLING DIMENSION: MILLIMETER.
2 DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
3 DATUM PLANE AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4 DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
5 DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE AC.
6 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
8 MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9 EXACT SHAPE OF EACH CORNER IS OPTIONAL.
MILLIMETERS
DIM MIN MAX
A 4.000 BSC
A1 2.000 BSC
B 4.000 BSC
B1 2.000 BSC
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G 0.500 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M
12 _REF
N 0.090 0.160
P 0.250 BSC
Q 0_ 7_
R 0.150 0.250
S 6.000 BSC
S1 3.000 BSC
V 6.000 BSC
V1 3.000 BSC
W 0.200 REF
X
1.000 REF
CE
M_
TOP & BOTTOM
R
H
W
K
Q_
GAUGE
PLANE
0.250
X
DETAIL AD
T, U, Z
AE AE
P
G
DETAIL Y
JÉÉÉÇÇÇÉÉÉÇÇÇÉÉÉÇÇÇÉÉÉ N
F
D
0.080 AC T–U Z
SECTION AE–AE
MOTOROLA RF/IF DEVICE DATA _{For More Information On This Product,}
15
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