MMG3002NT1 Datasheet, PDF (11/16 Pages) Motorola, Inc – Heterojunction Bipolar Transistor Technology (InGaP HBT)

Freescale Semiconductor, Inc.
1.7
7.62
0.305 diameter
3.48
5.33
1.27
0.58
0.86
0.64
3.86
Recommended Solder Stencil
2.49
1.27
2.54
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
PITCH.
Figure 22. Recommended Mounting Configuration
MOTOROLA RF DEVICE DATA
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MMG3002NT1
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