MC145444 Datasheet, PDF (11/12 Pages) Motorola, Inc – Single-Chip 300-Baud Modem

20
1
–A–
H
G
F
PACKAGE DIMENSIONS
H SUFFIX
PLASTIC DIP
CASE 804–01
11
B
10
C
K
N
–T–
SEATING
PLANE
M
D 20 PL
0.25 (0.010) M T A M
L
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. CONTROLLING DIMENSION: INCH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.930 0.970 23.63 24.63
B 0.240 0.260 6.10 6.60
C 0.150 0.170 3.81 4.31
D 0.015 0.022 0.38 0.56
F 0.050 0.070 1.27 1.78
G 0.100 BSC
2.54 BSC
H 0.030 NOM
0.76 NOM
J 0.009 0.013 0.23 0.33
K 0.115 0.140 2.93 3.55
L 0.300 BSC
7.62 BSC
M
0_{_} 15_{_} 0 _{_} 15_{_}
N 0.020 0.040 0.51 1.02
DW SUFFIX
SOG PACKAGE
CASE 751D–04
–A–
20
11
–B– 10X P
0.010 (0.25) M B M
1
10
20X D
J
0.010 (0.25) M T A S B S
F
18X G
C
–T–
SEATING
PLANE
M
K
R X 45_{_}
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 12.65 12.95 0.499 0.510
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G
1.27 BSC
0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M 0_{_} 7_{_} 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
MOTOROLA
MC145444
11