MCM63F737K Datasheet, PDF (10/20 Pages) Motorola, Inc – 128K x 36 and 256K x 18 Bit Flow–Through BurstRAM Synchronous Fast Static RAM

WRITE TRUTH TABLE
Freescale Semiconductor, Inc.
Cycle Type
SGW
SW
Read
H
H
Read
H
L
Write Byte a
H
L
Write Byte b
H
L
Write Byte c (See Note 1)
H
L
Write Byte d (See Note 1)
H
L
Write All Bytes
H
L
Write All Bytes
L
X
NOTE:
1. Valid Only for MCM63F737K.
SBa
SBb
X
X
H
H
L
H
H
L
H
H
H
H
L
L
X
X
SBc
(See Note 1)
X
H
H
H
L
H
L
X
SBd
(See Note 1)
X
H
H
H
H
L
L
X
ABSOLUTE MAXIMUM RATINGS (See Note 1)
Rating
Symbol
Value
Unit Notes
Power Supply Voltage
VDD
VSS – 0.5 to 4.6
V
I/O Supply Voltage
VDDQ VSS – 0.5 to VDD V
Input Voltage Relative to VSS for Vin, Vout
VSS – 0.5 to
V
Any Pin Except VDD
VDD + 0.5
Input Voltage (Three–State I/O)
VIT
VSS – 0.5 to
V
VDDQ + 0.5
Output Current (per I/O)
Iout
±20
mA
Package Power Dissipation
PD
1.6
W
2
Temperature Under Bias
Tbias
–10 to 85
°C
Storage Temperature
Tstg
–55 to 125
°C
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
2. Power dissipation capability is dependent upon package characteristics and use
environment. See Package Thermal Characteristics.
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.
PACKAGE THERMAL CHARACTERISTICS
Rating
Symbol
Max
Unit Notes
TQFP
Junction to Ambient (@ 200 lfm)
Single–Layer Board
Four–Layer Board
R_θJA
40
°C/W 1, 2
25
Junction to Board (Bottom)
Junction to Case (Top)
PBGA
R_θJB
R_θJC
17
°C/W
3
9
°C/W
4
Junction to Ambient (@ 200 lfm)
Single–Layer Board
Four–Layer Board
R_θJA
38
°C/W 1, 2
22
Junction to Board (Bottom)
R_θJB
14
°C/W
3
Junction to Case (Top)
R_θJC
5
°C/W
4
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, board population, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method 1012.1).
MCM63F737K•MCM63F819K _{For More Information On This Product,}
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