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MTB6N60E Datasheet, PDF (1/10 Pages) Motorola, Inc – TMOS POWER FET 6.0 AMPERES 600 VOLTS | |||
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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by MTB6N60E/D
⢠Designer's Data Sheet
TMOS E-FET.â¢
High Energy Power FET
D2PAK for Surface Mount
NâChannel EnhancementâMode Silicon Gate
The D2PAK package has the capability of housing a larger die
than any existing surface mount package which allows it to be used
in applications that require the use of surface mount components
with higher power and lower RDS(on) capabilities. This advanced
TMOS EâFET is designed to withstand high energy in the
avalanche and commutation modes. The new energy efficient
design also offers a drainâtoâsource diode with a fast recovery
time. Designed for low voltage, high speed switching applications in
power supplies, converters and PWM motor controls, these
devices are particularly well suited for bridge circuits where diode
speed and commutating safe operating areas are critical and offer
additional safety margin against unexpected voltage transients.
⢠Robust High Voltage Termination
⢠Avalanche Energy Specified
G
⢠SourceâtoâDrain Diode Recovery Time Comparable to a
Discrete Fast Recovery Diode
⢠Diode is Characterized for Use in Bridge Circuits
⢠IDSS and VDS(on) Specified at Elevated Temperature
⢠Short Heatsink Tab Manufactured â Not Sheared
⢠Specially Designed Leadframe for Maximum Power Dissipation
⢠Available in 24 mm 13âinch/800 Unit Tape & Reel, Add T4
Suffix to Part Number
®
D
S
MTB6N60E
Motorola Preferred Device
TMOS POWER FET
6.0 AMPERES
600 VOLTS
RDS(on) = 1.2 OHM
CASE 418Bâ03, Style 2
D2PAK
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
DrainâtoâSource Voltage
VDSS
600
Vdc
DrainâtoâGate Voltage (RGS = 1.0 Mâ¦)
VDGR
600
Vdc
GateâSource Voltage â Continuous
GateâSource Voltage â NonâRepetitive (tp ⤠10 ms)
VGS
± 20
Vdc
VGSM
± 40
Vpk
Drain Current â Continuous
Drain Current â Continuous @ 100°C
Drain Current â Single Pulse (tp ⤠10 µs)
ID
6.0
Adc
ID
4.6
IDM
18
Apk
Total Power Dissipation @ 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (1)
PD
125
Watts
1.0
W/°C
2.5
Watts
Operating and Storage Temperature Range
TJ, Tstg â 55 to 150 °C
Single Pulse DrainâtoâSource Avalanche Energy â Starting TJ = 25°C
(VDD = 100 Vdc, VGS = 10 Vdc, Peak IL = 9.0 Apk, L = 10 mH, RG = 25 â¦)
EAS
mJ
405
Thermal Resistance â Junction to Case
Thermal Resistance â Junction to Ambient
Thermal Resistance â Junction to Ambient (1)
RθJC
RθJA
RθJA
1.0
°C/W
62.5
50
Maximum Lead Temperature for Soldering Purposes, 1/8â³ from case for 10 seconds
(1) When surface mounted to an FR4 board using the minimum recommended pad size.
TL
260
°C
Designerâs Data for âWorst Caseâ Conditions â The Designerâs Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves â representing boundaries on device characteristics â are given to facilitate âworst caseâ design.
EâFET and Designerâs are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
©MMoottoororolal,aInTc.M19O9S7 Power MOSFET Transistor Device Data
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