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MTB36N06V Datasheet, PDF (1/10 Pages) Motorola, Inc – TMOS POWER FET 32 AMPERES 60 VOLTS | |||
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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by MTB36N06V/D
⢠Designer's Data Sheet
TMOS Vâ¢
Power Field Effect Transistor
D2PAK for Surface Mount
NâChannel EnhancementâMode Silicon Gate
TMOS V is a new technology designed to achieve an onâresistance
area product about oneâhalf that of standard MOSFETs. This new
technology more than doubles the present cell density of our 50
and 60 volt TMOS devices. Just as with our TMOS EâFET designs,
TMOS V is designed to withstand high energy in the avalanche and
commutation modes. Designed for low voltage, high speed
switching applications in power supplies, converters and power
motor controls, these devices are particularly well suited for bridge
circuits where diode speed and commutating safe operating areas
are critical and offer additional safety margin against unexpected
voltage transients.
New Features of TMOS V
⢠Onâresistance Area Product about Oneâhalf that of Standard
G
MOSFETs with New Low Voltage, Low RDS(on) Technology
⢠Faster Switching than EâFET Predecessors
Features Common to TMOS V and TMOS EâFETs
⢠Avalanche Energy Specified
⢠IDSS and VDS(on) Specified at Elevated Temperature
⢠Static Parameters are the Same for both TMOS V and
TMOS EâFET
⢠Surface Mount Package Available in 16 mm 13âinch/2500 Unit
Tape & Reel, Add T4 Suffix to Part Number
MTB36N06V
Motorola Preferred Device
TMOS POWER FET
32 AMPERES
60 VOLTS
RDS(on) = 0.04 OHM
TM
D
CASE 418Bâ02, Style 2
S
D2PAK
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
DrainâtoâSource Voltage
DrainâtoâGate Voltage (RGS = 1.0 Mâ¦)
GateâtoâSource Voltage â Continuous
GateâSource Voltage â NonâRepetitive (tp ⤠50 µs)
Drain Current â Continuous @ 25°C
Drain Current â Continuous @ 100°C
Drain Current â Single Pulse (tp ⤠10 µs)
Total Power Dissipation @ 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (1)
Operating and Storage Temperature Range
Single Pulse DrainâtoâSource Avalanche Energy â STARTING TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc, PEAK IL = 32 Apk, L = 0.1 mH, RG = 25 â¦)
VDSS
VDGR
VGS
VGSM
ID
ID
IDM
PD
TJ, Tstg
EAS
60
60
± 20
± 25
32
22.6
112
90
0.6
3.0
â 55 to 175
205
Vdc
Vdc
Vdc
Vpk
Adc
Apk
Watts
W/°C
Watts
°C
mJ
Thermal Resistance â Junction to Case
Thermal Resistance â Junction to Ambient
Thermal Resistance â Junction to Ambient (1)
RθJC
RθJA
RθJA
1.67
°C/W
62.5
50
Maximum Lead Temperature for Soldering Purposes, 1/8â³ from Case for 10 seconds
(1) When surface mounted to an FR4 board using the minimum recommended pad size.
TL
260
°C
Designerâs Data for âWorst Caseâ Conditions â The Designerâs Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves â representing boundaries on device characteristics â are given to facilitate âworst caseâ design.
Designerâs is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
REV 2
© MMoototororloa,laIncT.M19O96S Power MOSFET Transistor Device Data
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