MMQA Datasheet, PDF (1/8 Pages) Motorola, Inc – SC-59 Quad Monolithic Common Anode

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MMQA/D
SCĆ59 Quad Monolithic
Common Anode
Transient Voltage Suppressor
for ESD Protection
This quad monolithic silicon voltage suppressor is designed for applications
requiring transient overvoltage protection capability. It is intended for use in
voltage and ESD sensitive equipment such as computers, printers, business
machines, communication systems, medical equipment, and other applica-
tions. Its quad junction common anode design protects four separate lines
using only one package. These devices are ideal for situations where board
space is at a premium.
Specification Features:
• SC-59 Package Allows Four Separate Unidirectional Configurations
• Peak Power — Min. 24 W @ 1.0 ms (Unidirectional), per Figure 5 Waveform
• Peak Power — Min. 150 W @ 20 ms (Unidirectional), per Figure 6 Waveform
• Maximum Clamping Voltage @ Peak Pulse Current
• Low Leakage < 2.0 µA
• ESD Rating of Class N (exceeding 16 kV) per the Human Body Model
Mechanical Characteristics:
• Void Free, Transfer-Molded, Thermosetting Plastic Case
• Corrosion Resistant Finish, Easily Solderable
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel. Replace
with “T3” in the Device Number to order the 13 inch/10,000 unit reel.
MMQA Series
Motorola Preferred Devices
SC-59 QUAD
TRANSIENT VOLTAGE
SUPPRESSOR
24 WATTS PEAK POWER
5.6 – 33 VOLTS
65
4
12
3
CASE 318F-01
STYLE 1
SC-59 PLASTIC
1
6
2
5
3
4
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Peak Power Dissipation @ 1.0 ms (1) @ TA ≤ 25°C
Peak Power Dissipation @ 20 ms (2) @ TA ≤ 25°C
Total Power Dissipation on FR-5 Board (3) @ TA = 25°C
Symbol
Ppk
Ppk
°PD°
Thermal Resistance from Junction to Ambient
Total Power Dissipation on Alumina Substrate (4) @ TA = 25°C
Derate above 25°C
R_θJA
°PD°
Thermal Resistance from Junction to Ambient
R_θJA
Junction and Storage Temperature Range
TJ, Tstg
Lead Solder Temperature — Maximum (10 Second Duration)
TL
1. Non-repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 4.
2. Non-repetitive current pulse per Figure 6 and derate above TA = 25°C per Figure 4.
3. FR-5 = 1.0 x 0.75 x 0.62 in.
4. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
Preferred devices are Motorola recommended choices for future use and best overall value.
Thermal Clad is a trademark of the Bergquist Company
Value
24
150
°225
1.8
556
°300
2.4
417
°– 55 to +150°
260
Unit
Watts
Watts
°mW°
mW/°C
°C/W
°mW
mW/°C
°C/W
°C
°C
© M_Mo_Mtor_Qola_A, I_Snc_e. _r1_i9_e9_s6
MOTOROLA
1