MMFT2N02EL Datasheet, PDF (1/10 Pages) Motorola, Inc – MEDIUM POWER LOGIC LEVEL TMOS FET 1.6 AMP 20 VOLTS

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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by MMFT2N02EL/D
Medium Power Field Effect Transistor
t ^{N–Channel Enhancement Mode}
Silicon Gate TMOS E–FET
SOT–223 for Surface Mount
This advanced E–FET is a TMOS Medium Power MOSFET
designed to withstand high energy in the avalanche and commuta-
tion modes. This device is also designed with a low threshold
voltage so it is fully enhanced with 5 Volts. This new energy efficient
device also offers a drain–to–source diode with a fast recovery
time. Designed for low voltage, high speed switching applications in
power supplies, dc–dc converters and PWM motor controls, these
devices are particularly well suited for bridge circuits where diode
speed and commutating safe operating areas are critical and offer
additional safety margin against unexpected voltage transients.
The device is housed in the SOT–223 package which is designed
for medium power surface mount applications.
• Silicon Gate for Fast Switching Speeds
1
G
• Low Drive Requirement to Interface Power Loads to Logic
Level ICs, VGS(th) = 2 Volts Max
• Low RDS(on) — 0.15 Ω max
• The SOT–223 Package can be Soldered Using Wave or Re-
flow. The Formed Leads Absorb Thermal Stress During Sol-
dering, Eliminating the Possibility of Damage to the Die
• Available in 12 mm Tape and Reel
Use MMFT2N02ELT1 to order the 7 inch/1000 unit reel.
Use MMFT2N02ELT3 to order the 13 inch/4000 unit reel.
®
2,4
D
S
3
MMFT2N02EL
Motorola Preferred Device
MEDIUM POWER
LOGIC LEVEL TMOS FET
1.6 AMP
20 VOLTS
RDS(on) = 0.15 OHM
4
1
2
3
CASE 318E–04, STYLE 3
TO–261AA
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Drain–to–Source Voltage
Gate–to–Source Voltage — Continuous
Drain Current — Continuous
Drain Current — Pulsed
Total Power Dissipation @ TA = 25°C
Derate above 25°C
VDS
VGS
ID
IDM
PD(1)
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C
(VDD = 10 V, VGS = 5 V, Peak IL= 2 A, L = 0.2 mH, RG = 25 Ω)
TJ, Tstg
EAS
DEVICE MARKING
2N02L
THERMAL CHARACTERISTICS
Thermal Resistance — Junction–to–Ambient (surface mounted)
Maximum Temperature for Soldering Purposes,
Time in Solder Bath
R_θJA
TL
(1) Power rating when mounted on FR–4 glass epoxy printed circuit board using recommended footprint.
TMOS is a registered trademark of Motorola, Inc.
E–FET is a trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 3
Value
20
± 15
1.6
6.4
0.8
6.4
– 65 to 150
66
156
260
10
Unit
Vdc
Adc
Watts
mW/°C
°C
mJ
°C/W
°C
Sec
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