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MC14572UB Datasheet, PDF (1/5 Pages) ON Semiconductor – Hex Gate
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Hex Gate
The MC14572UB hex functional gate is constructed with MOS P–channel
and N–channel enhancement mode devices in a single monolithic structure.
These complementary MOS logic gates find primary use where low power
dissipation and/or high noise immunity is desired. The chip contains four
inverters, one NOR gate and one NAND gate.
• Diode Protection on All Inputs
• Single Supply Operation
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• NOR Input Pin Adjacent to VSS Pin to Simplify Use As An Inverter
• NAND Input Pin Adjacent to VDD Pin to Simplify Use As An Inverter
• NOR Output Pin Adjacent to Inverter Input Pin For OR Application
• NAND Output Pin Adjacent to Inverter Input Pin For AND Application
• Capable of Driving Two Low–power TTL Loads or One Low–Power
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Schottky TTL Load over the Rated Temperature Range
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MAXIMUM RATINGS* (Voltages Referenced to VSS)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol
Parameter
Value
Unit
VDD DC Supply Voltage
– 0.5 to + 18.0
V
Vin, Vout Input or Output Voltage (DC or Transient) – 0.5 to VDD + 0.5 V
Iin, Iout Input or Output Current (DC or Transient),
± 10
mA
per Pin
PD Power Dissipation, per Package†
500
mW
Tstg Storage Temperature
– 65 to + 150
_C
TL
Lead Temperature (8–Second Soldering)
260
_C
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
CIRCUIT SCHEMATIC
VDD
VDD
VDD
7
2
1
6
VSS
5
14
15
VSS
13
VSS
MC14572UB
L SUFFIX
CERAMIC
CASE 620
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
ORDERING INFORMATION
MC14XXXUBCP
MC14XXXUBCL
MC14XXXUBD
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
LOGIC DIAGRAM
2
1
4
3
6
5
7
10
9
12
11
14
13
15
VDD = PIN 16
VSS = PIN 8
REV 3
1/94
©MMOotoTrOolaR, IOncL. A199C5MOS LOGIC DATA
MC14572UB
1